|
<Types
and Characteristics for Lead-free Solder> |
|
Type 種類 |
Specification 規格 |
Melting Point 熔點 |
Characteristics 特點 |
|
Sn-Ag-Cu Series |
Sn-(3.8-4)Ag-(0.5-0.7)Cu |
215-218 |
Widely draw
attention and likely act as the standard of lead-free product. By adding
Bi will lower the melting point while by adding small amount of Sb will
strongly control the growing of chemicals over the soldering medals
surface, which strongly increase the reliability of the soldering point. 受到廣泛關注，可能成為無鉛料的標準。性能良好，進一步加添少量Bi可降低熔點；進一步加添少量Sb可有效抑制焊點介面金屬間化合物生長，提高焊點可靠性。 |
|
Sn-Ag Series |
Sn-3.5Ag |
221 |
Widely-used and
long history, excellent capability具悠久使用歷史，性能良好 |
|
Sn-5Ag |
221-240 |
||
|
Sn-Cu Series |
Sn-0.7Cu |
227 |
Lowest Cost 成本最低 |
|
Sn-3Cu |
227-200 |
||
|
Sn-Sb Series |
Sn-3Sb |
232-23 |
Good connectivity高強度，焊接性好 |
|
Sn-5Sb |
232-240 |